The Chemical Mechanical Polishing of Copper - Plated Films and Its Electrochemical Characteristics

Date Issued

2000

Date

2000

Author(s)

DOI

892214E002030

URI

Subjects

chemical mechanical polishing

electrochemical technology

copper metallization process

Publisher

臺北市：國立臺灣大學化學工程學系暨研究所

Type

report

File(s)

Name

892214E002030.pdf

Size

550.04 KB

Format

Adobe PDF

Checksum

(MD5):28c995924b375c96c18be04f2ac96694