Silver as a highly effective bonding layer for lead telluride thermoelectric modules assembled by rapid hot-pressing

Journal

Energy Conversion and Management

Journal Volume

98

Pages

134-137

Date Issued

2015

Author(s)

Li C.C.

Drymiotis F.

Liao L.L.

Dai M.J.

Liu C.K.

Chen C.L.

Chen Y.Y.

Kao C.R.

Snyder G.J.

DOI

10.1016/j.enconman.2015.03.089

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84926625838&doi=10.1016%2fj.enconman.2015.03.089&partnerID=40&md5=13834c047d8ac2e9f058b8a1a4556f09

https://scholars.lib.ntu.edu.tw/handle/123456789/432606

Publisher

Elsevier Ltd

Type

journal article