Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al2O3 with Sn interlayers

Resource

Journal of Electronic Materials 32 (9): 952-956

Journal

Journal of Electronic Materials

Journal Volume

32

Journal Issue

9

Pages

952-956

Date Issued

2003

Date

2003

Author(s)

Liang, M. W.

Hsieh, T. E.

Chang, S. Y.

Chuang, T. H.

URI

Type

journal article

File(s)

Name

82.pdf

Size

216.02 KB

Format

Adobe PDF

Checksum

(MD5):a306a11d5b996a944ad17d17ce49a7e9