Design and Fabrication of Micro Accelerometers with a Hybrid Sensing Technology
Date Issued
2007
Date
2007
Author(s)
Chen, Kuo-Tien
DOI
zh-TW
Abstract
The goal of this thesis is to increase the sensing types in a micro accelerometer and to achieve batch-fabricated utilizing a kind of MEMS fabrication technology.
The micro accelerometer’s dimension is 1970μm×1610μm, and it is fabricated by the MetalMUMPs process supplied by MEMSCAP Inc., America. The most distinguishing feature in MetalMUMPs is that electroplated nickel, about 20 μm, is used as the primary structural material and electrical interconnect layer.
There was only one sensing type in traditional micro accelerometers while the one proposed in this thesis has two kinds of sensing types in the sensing axis.
One is capacitive sensing: Utilizing Nickel as the comb fingers in the capacitive parallel plates structure, there 100 fingers (200 gaps ) in each side to increase the capacitance. The other is piezoresistive sensing: Utilizing piezoresistive poly-silicon clad by Si3N4 as sensing the change of resistance. Furthermore, Wheatstone Bridge is substituted for change of resistance, i.e. voltage out is instead of resistance out.
Besides, simulation and math tools, ANSYS & MATHCAD, are applied to simply simulate the micro accelerometers. Finally, the experimental data and simulated datat will be discussed and compared in this article.
Subjects
微機電
加速計
電容式感測
壓阻式感測
MetalMUMPs
MEMS
accelerometers
capacitive sensing
piezoresistive sensing
Type
thesis
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