Quality Improvement of Ultrathin Gate Oxide by Using Thermal Growth Followed by SF ANO Technique
Resource
IEEE ELECTRON DEVICE LETTERS, VOL. 25, NO. 10, OCTOBER 2004
Journal
IEEE ELECTRON DEVICE LETTERS
Journal Volume
VOL. 25
Journal Issue
NO. 10
Pages
-
Date Issued
2004-10
Date
2004-10
Author(s)
Yang, Yi-Lin
DOI
246246/200611150121591
Abstract
Rapid thermal oxide followed by anodization in direct
current superimposed with scanning frequency alternating current
was demonstrated for the first time to have an improved quality
in ultrathin gate oxides. Compared with the thermal oxide grown
without the scanning-frequency anodization (SF ANO) treatment,
the gate leakage current density ( ) of SF ANO sample is significantly
reduced without increasing the thickness of gate oxide. In
addition, it could be observed that the interface trap density ( it)
is reduced with tighter distribution. It is suggested that the bulk
traps and interface traps in thermally grown oxide can be repaired
during the SF ANO process.
current superimposed with scanning frequency alternating current
was demonstrated for the first time to have an improved quality
in ultrathin gate oxides. Compared with the thermal oxide grown
without the scanning-frequency anodization (SF ANO) treatment,
the gate leakage current density ( ) of SF ANO sample is significantly
reduced without increasing the thickness of gate oxide. In
addition, it could be observed that the interface trap density ( it)
is reduced with tighter distribution. It is suggested that the bulk
traps and interface traps in thermally grown oxide can be repaired
during the SF ANO process.
Subjects
Metal–oxide–semiconductor (MOS)
scanning
frequency anodization (SF ANO)
frequency anodization (SF ANO)
ultrathin gate oxide
Publisher
Taipei:National Taiwan University Dept Mech Engn
Type
journal article
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