https://scholars.lib.ntu.edu.tw/handle/123456789/301689| Title: | An investigation of smooth nano-sized copper seed layers on TiN and TaSiN by new non-toxic electroless plating | Authors: | Liu, R. S. You, C. C. Tsai, M. S. Hu, S. F. Li, Y. H. Lu, C. P. RU-SHI LIU |
Issue Date: | 2003 | Journal Volume: | 125 | Journal Issue: | 7-8 | Start page/Pages: | 445-448 | Source: | Solid State Communications | URI: | http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=ORCID&SrcApp=OrcidOrg&DestLinkType=FullRecord&DestApp=WOS_CPL&KeyUT=WOS:000181023700018&KeyUID=WOS:000181023700018 http://scholars.lib.ntu.edu.tw/handle/123456789/301689 |
DOI: | 10.1016/s0038-1098(02)00821-9 |
| Appears in Collections: | 化學系 |
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