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College of Science / 理學院
Chemistry / 化學系
An investigation of smooth nano-sized copper seed layers on TiN and TaSiN by new non-toxic electroless plating
Details
An investigation of smooth nano-sized copper seed layers on TiN and TaSiN by new non-toxic electroless plating
Journal
Solid State Communications
Journal Volume
125
Journal Issue
7-8
Pages
445-448
Date Issued
2003
Author(s)
RU-SHI LIU
You, C. C.
Tsai, M. S.
Hu, S. F.
Li, Y. H.
Lu, C. P.
DOI
10.1016/s0038-1098(02)00821-9
URI
http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=ORCID&SrcApp=OrcidOrg&DestLinkType=FullRecord&DestApp=WOS_CPL&KeyUT=WOS:000181023700018&KeyUID=WOS:000181023700018
http://scholars.lib.ntu.edu.tw/handle/123456789/301689
Type
journal article