https://scholars.lib.ntu.edu.tw/handle/123456789/301689
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Liu, R. S. | en_US |
dc.contributor.author | You, C. C. | en_US |
dc.contributor.author | Tsai, M. S. | en_US |
dc.contributor.author | Hu, S. F. | en_US |
dc.contributor.author | Li, Y. H. | en_US |
dc.contributor.author | Lu, C. P. | en_US |
dc.contributor.author | RU-SHI LIU | zz |
dc.creator | Liu, R. S.;You, C. C.;Tsai, M. S.;Hu, S. F.;Li, Y. H.;Lu, C. P. | - |
dc.date.accessioned | 2018-09-10T04:28:29Z | - |
dc.date.available | 2018-09-10T04:28:29Z | - |
dc.date.issued | 2003 | - |
dc.identifier.uri | http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=ORCID&SrcApp=OrcidOrg&DestLinkType=FullRecord&DestApp=WOS_CPL&KeyUT=WOS:000181023700018&KeyUID=WOS:000181023700018 | - |
dc.identifier.uri | http://scholars.lib.ntu.edu.tw/handle/123456789/301689 | - |
dc.language | en | en |
dc.relation.ispartof | Solid State Communications | en_US |
dc.source | AH | - |
dc.title | An investigation of smooth nano-sized copper seed layers on TiN and TaSiN by new non-toxic electroless plating | - |
dc.type | journal article | en |
dc.identifier.doi | 10.1016/s0038-1098(02)00821-9 | - |
dc.identifier.scopus | 2-s2.0-0037303599 | - |
dc.identifier.isi | WOS:000181023700018 | - |
dc.relation.pages | 445-448 | - |
dc.relation.journalvolume | 125 | - |
dc.relation.journalissue | 7-8 | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.openairetype | journal article | - |
item.grantfulltext | none | - |
item.cerifentitytype | Publications | - |
item.fulltext | no fulltext | - |
crisitem.author.dept | Chemistry | - |
crisitem.author.orcid | 0000-0002-1291-9052 | - |
crisitem.author.parentorg | College of Science | - |
顯示於: | 化學系 |
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