https://scholars.lib.ntu.edu.tw/handle/123456789/301813
Title: | Thermal stress at wafer contact points in rapid thermal processing investigated by repeated spike treatment before oxidation | Authors: | JENN-GWO HWU | Issue Date: | 2003 | Journal Volume: | 93 | Journal Issue: | 4 | Start page/Pages: | 2225-2228 | Source: | Journal of Applied Physics | URI: | http://www.scopus.com/inward/record.url?eid=2-s2.0-0037443049&partnerID=MN8TOARS http://scholars.lib.ntu.edu.tw/handle/123456789/301813 |
DOI: | 10.1063/1.1539536 |
Appears in Collections: | 電機工程學系 |
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