Design for Electrical Performance of Wideband Multilayer LTCC Microstrip-to-Stripline Transition
Resource
Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th
Journal
Electronics Packaging Technology Conference
Pages
FP-013
Date Issued
2004-12
Author(s)
Abstract
A high impedance compensation technique is proposed to improve the wideband performance of the microstrip-to-stripline transition for multilayer LTCC substrate. A section of high impedance transmission line, which induces additional inductance, is added between the transition and 50 /spl Omega/ transmission line to compensate the capacitance of the transition. In the paper, various lengths and widths of the high impedance transmission line are simulated by HFSS and compared to optimize the electrical performance which achieves a return loss better than 17 dB over a band from DC to 70 GHz.
SDGs
Type
conference paper
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