Skip to main content
English
中文
Log In
Log in
Log in with ORCID
NTU Single Sign On
Have you forgotten your password?
Home
College of Engineering / 工學院
Mechanical Engineering / 機械工程學系
Quantitative reliability analysis of electronic packages in consideration of variability of model parameters
Details
Quantitative reliability analysis of electronic packages in consideration of variability of model parameters
Journal
7th Electronics Packaging Technology Conference
Journal Volume
2
Pages
625-630
Date Issued
2005
Author(s)
Wu, W.-F.
Lin, Y.-Y.
Young, H.-T.
HONG-TSU YOUNG
URI
http://www.scopus.com/inward/record.url?eid=2-s2.0-33847326816&partnerID=MN8TOARS
http://scholars.lib.ntu.edu.tw/handle/123456789/315014
Type
conference paper