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College of Electrical Engineering and Computer Science / 電機資訊學院
Communication Engineering / 電信工程學研究所
Model Extractions of Coupled Bonding-wire Structures in Electronic Packaging
Details
Model Extractions of Coupled Bonding-wire Structures in Electronic Packaging
Journal
Asia-Pacific Microwave Conference, APMC
Pages
275-278
Date Issued
2005-12
Author(s)
Hao-Geng Lin
Tian-Wei Huang
RUEY-BEEI WU
Chien-Min Lin
TIAN-WEI HUANG
DOI
10.1109/APMC.2005.1606252
URI
http://scholars.lib.ntu.edu.tw/handle/123456789/317990
Type
conference paper
