https://scholars.lib.ntu.edu.tw/handle/123456789/321874
Title: | Enhancement in ultrathin oxide growth by thermal-induced tensile stress | Authors: | Hung, C.-J. JENN-GWO HWU |
Issue Date: | 2006 | Journal Volume: | 6 | Journal Issue: | 1 | Start page/Pages: | 28-32 | Source: | IEEE Transactions on Device and Materials Reliability | Abstract: | Rapid-thermal oxide grown under the condition that a certain portion of the substrate wafer was covered by another wafer with special shape was studied. It is interesting to find that in the ultrathin oxide regime, the thickness of oxide with covered wafer is even larger than that without. Thermal-induced tensile stress is believed to be the origin of the above enhanced oxidation rate. A novel ultrathin oxide grown at a low temperature of 800 °C is demonstrated. The capacitance-voltage and current-voltage characteristics of MOS capacitors with oxides grown with and without cover wafers under the same oxide thickness were compared. © 2006 IEEE. |
URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-33645801785&doi=10.1109%2fTDMR.2006.870339&partnerID=40&md5=66b2d2fd86e87e6e50dac39e19cbce5e http://scholars.lib.ntu.edu.tw/handle/123456789/321874 |
DOI: | 10.1109/TDMR.2006.870339 | SDG/Keyword: | Tensile stress; Thermal oxidation; Thermal stress; Ultrathin oxide |
Appears in Collections: | 電機工程學系 |
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