https://scholars.lib.ntu.edu.tw/handle/123456789/322320
Title: | Novel method for in-situ monitoring of thickness of silicon wafer during wet etching | Authors: | LEE, CY CHANG, PZ CHEN, YY et al. PING-HEI CHEN |
Issue Date: | 2006 | Journal Volume: | 18 | Journal Issue: | 2 | Start page/Pages: | 71-82 | Source: | Sensors and Materials | URI: | http://scholars.lib.ntu.edu.tw/handle/123456789/322320 |
Appears in Collections: | 機械工程學系 |
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