https://scholars.lib.ntu.edu.tw/handle/123456789/322320
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | LEE, CY | en_US |
dc.contributor.author | CHANG, PZ | en_US |
dc.contributor.author | CHEN, YY | en_US |
dc.contributor.author | et al. | en_US |
dc.contributor.author | PING-HEI CHEN | en_US |
dc.creator | PING-HEI CHEN;et al.;CHEN, YY;CHANG, PZ;LEE, CY | - |
dc.date.accessioned | 2018-09-10T05:53:35Z | - |
dc.date.available | 2018-09-10T05:53:35Z | - |
dc.date.issued | 2006 | - |
dc.identifier.uri | http://scholars.lib.ntu.edu.tw/handle/123456789/322320 | - |
dc.language | en | en |
dc.relation.ispartof | Sensors and Materials | - |
dc.source | AH | - |
dc.title | Novel method for in-situ monitoring of thickness of silicon wafer during wet etching | - |
dc.type | journal article | en |
dc.relation.pages | 71-82 | - |
dc.relation.journalvolume | 18 | - |
dc.relation.journalissue | 2 | - |
item.openairetype | journal article | - |
item.fulltext | no fulltext | - |
item.cerifentitytype | Publications | - |
item.grantfulltext | none | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
crisitem.author.dept | Mechanical Engineering | - |
crisitem.author.orcid | 0000-0002-8073-9344 | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 機械工程學系 |
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