https://scholars.lib.ntu.edu.tw/handle/123456789/333828
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | T.-K. Wang | en_US |
dc.contributor.author | S.-T. Chen | en_US |
dc.contributor.author | C.-W. Tsai | en_US |
dc.contributor.author | S.-M. Wu | en_US |
dc.contributor.author | J. J. Drewniak | en_US |
dc.contributor.author | T.-L. Wu | en_US |
dc.contributor.author | TZONG-LIN WU | zz |
dc.creator | T.-K. Wang;S.-T. Chen;C.-W. Tsai;S.-M. Wu;J. J. Drewniak;T.-L. Wu | - |
dc.date.accessioned | 2018-09-10T06:37:20Z | - |
dc.date.available | 2018-09-10T06:37:20Z | - |
dc.date.issued | 2007-11 | - |
dc.identifier.uri | http://scholars.lib.ntu.edu.tw/handle/123456789/333828 | - |
dc.language | en | en |
dc.relation.ispartof | IEEE Transactions on Advanced Packaging | en_US |
dc.source | AH-anncc | - |
dc.title | Modeling noise coupling between package and PCB power/ground planes with an efficient 2-D FDTD/lumped element method | - |
dc.type | journal article | en |
dc.identifier.doi | 10.1109/tadvp.2007.901764 | - |
dc.identifier.scopus | 2-s2.0-36348967803 | - |
dc.identifier.isi | WOS:000250897200029 | - |
dc.relation.pages | 864-871 | - |
dc.relation.journalvolume | 30 | - |
dc.relation.journalissue | 4 | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.openairetype | journal article | - |
item.grantfulltext | none | - |
item.cerifentitytype | Publications | - |
item.fulltext | no fulltext | - |
crisitem.author.dept | Electrical Engineering | - |
crisitem.author.dept | Communication Engineering | - |
crisitem.author.orcid | 0000-0002-3560-8898 | - |
crisitem.author.parentorg | College of Electrical Engineering and Computer Science | - |
crisitem.author.parentorg | College of Electrical Engineering and Computer Science | - |
顯示於: | 電機工程學系 |
在 IR 系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。