Metal-density-driven placement for CMP variation and routability

Journal

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Journal Volume

27

Journal Issue

12

Pages

2145-2155

Date Issued

2008

Author(s)

Chen, T.-C.

Cho, M.

Pan, D.Z.

DOI

10.1109/TCAD.2008.2006148

URI

http://www.scopus.com/inward/record.url?eid=2-s2.0-56749109565&partnerID=MN8TOARS

http://scholars.lib.ntu.edu.tw/handle/123456789/341029

Type

journal article