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College of Electrical Engineering and Computer Science / 電機資訊學院
Electronics Engineering / 電子工程學研究所
Metal-density-driven placement for CMP variation and routability
Details
Metal-density-driven placement for CMP variation and routability
Journal
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Journal Volume
27
Journal Issue
12
Pages
2145-2155
Date Issued
2008
Author(s)
Chen, T.-C.
Cho, M.
Pan, D.Z.
YAO-WEN CHANG
DOI
10.1109/TCAD.2008.2006148
URI
http://www.scopus.com/inward/record.url?eid=2-s2.0-56749109565&partnerID=MN8TOARS
http://scholars.lib.ntu.edu.tw/handle/123456789/341029
Type
journal article