https://scholars.lib.ntu.edu.tw/handle/123456789/351856| Title: | A wide-band microstrip-to- microstrip multi-layered via transition using LTCC technology | Authors: | C.-C. Tsai Y.-S. Cheng T.-Y. Huang R.-B. Wu RUEY-BEEI WU |
Issue Date: | Dec-2009 | Source: | 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009 | URI: | http://scholars.lib.ntu.edu.tw/handle/123456789/351856 | DOI: | 10.1109/EDAPS.2009.5403997 |
| Appears in Collections: | 電機工程學系 |
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