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College of Electrical Engineering and Computer Science / 電機資訊學院
Electrical Engineering / 電機工程學系
A wide-band microstrip-to- microstrip multi-layered via transition using LTCC technology
Details
A wide-band microstrip-to- microstrip multi-layered via transition using LTCC technology
Journal
2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009
Date Issued
2009-12
Author(s)
C.-C. Tsai
Y.-S. Cheng
T.-Y. Huang
RUEY-BEEI WU
DOI
10.1109/EDAPS.2009.5403997
URI
http://scholars.lib.ntu.edu.tw/handle/123456789/351856
Type
conference paper