A stopband enhanced EBG power/ground plane based on via location design
Journal
IEEE Compon. Packag. Manuf. Technol. Symp. Japan
Date Issued
2010-08
Author(s)
C.-D. Wang
Abstract
A novel electromagnetic bandgap (EBG) structure power/ground plane by using multilayer stack-up structure and multiple vias is proposed. A wide stopband exhibited by the proposed EBG structure is used to suppress the power noise coupling between power/ground plane in the package. Both the upper and lower side cutoff frequencies are enhanced through the via connection and location design. A simplified one-dimensional equivalent model is established to explain the concept of the stopband enhancement. Different via position and the resultant bandgap variation are demonstrated by both dispersion diagram and S-parameter.
SDGs
Type
conference paper