A reactive modifier that enhances the thermal mechanical properties of epoxy resin through the formation of multiple hydrogen-bonded network
Journal
Journal of Polymer Research
Journal Volume
18
Journal Issue
5
Pages
1169-1176
Date Issued
2011
Author(s)
Juang, T.-Y.
Liu, J.-K.
Chang, C.-C.
Shau, S.-M.
Tsai, M.-H.
Dai, S.A.
Su, W.-C.
Lin, C.-H.
Jeng, R.-J.
Type
journal article