https://scholars.lib.ntu.edu.tw/handle/123456789/363492
Title: | Design and implementation of 3D-thermal test chip for exploration of package effects | Authors: | Chien, J.-H. Lung, C.-L. Lin, T.-W. Tsai, K.-J. Chen, T.-S. Chou, Y.-F. Chen, P.-H. Chang, S.-C. PING-HEI CHEN |
Issue Date: | 2011 | Start page/Pages: | 238-241 | Source: | International Microsystems, Packaging, Assembly, and Circuits Technology Conference | URI: | http://www.scopus.com/inward/record.url?eid=2-s2.0-84863119620&partnerID=MN8TOARS http://scholars.lib.ntu.edu.tw/handle/123456789/363492 |
DOI: | 10.1109/IMPACT.2011.6117289 |
Appears in Collections: | 機械工程學系 |
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