https://scholars.lib.ntu.edu.tw/handle/123456789/370896| Title: | Enhancement of through silicon via (TSV) sidewall quality by nanosecond laser pulses with chemical etching process | Authors: | Tang, C.-W. Young, H.-T. Li, K.-M. HONG-TSU YOUNG KUAN-MING LI |
Issue Date: | 2012 | Journal Volume: | 579 | Start page/Pages: | 3-9 | Source: | Advanced Materials Research | URI: | http://www.scopus.com/inward/record.url?eid=2-s2.0-84869384594&partnerID=MN8TOARS http://scholars.lib.ntu.edu.tw/handle/123456789/370896 |
DOI: | 10.4028/www.scientific.net/AMR.579.3 |
| Appears in Collections: | 機械工程學系 |
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