https://scholars.lib.ntu.edu.tw/handle/123456789/372404
Title: | 3D simulation of substrate noise coupling from Through Silicon Via (TSV) and noise isolation methods | Authors: | Lin, L.J.-H. Chang, H.-P. Wu, T.-L. Chiou, Y.-P. TZONG-LIN WU YIH-PENG CHIOU |
Issue Date: | 2012 | Start page/Pages: | 181-184 | Source: | 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2012 | URI: | http://www.scopus.com/inward/record.url?eid=2-s2.0-84875481074&partnerID=MN8TOARS http://scholars.lib.ntu.edu.tw/handle/123456789/372404 |
DOI: | 10.1109/EDAPS.2012.6469415 |
Appears in Collections: | 光電工程學研究所 |
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