Artificial neural network modeling for extrinsic capacitance of FinFET

Journal

IEEE 23rd Topical Meeting on Electrical Performance of Electronic Packaging and Systems

Pages

95-98

Date Issued

2014-10

Author(s)

W.-C. Chen

C.-P. Chang

M.-K. Kang

T.-Y. Huang

K.-B. Wu

DOI

URI

Type

conference paper