Fabrication of copper thin film patterns with highly adhesive silver-decorated polydopamine ink

Journal

Science of Advanced Materials

Journal Volume

7

Journal Issue

2

Pages

227-232

Date Issued

2015

Author(s)

Huang, Y.-K.

Chen, S.-P.

Su, C.-H.

Liao, Y.-C.

DOI

10.1166/sam.2015.2101

URI

http://www.scopus.com/inward/record.url?eid=2-s2.0-84937643951&partnerID=MN8TOARS

http://scholars.lib.ntu.edu.tw/handle/123456789/391354

Type

journal article