https://scholars.lib.ntu.edu.tw/handle/123456789/391354
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Huang, Y.-K. | en_US |
dc.contributor.author | Chen, S.-P. | en_US |
dc.contributor.author | Su, C.-H. | en_US |
dc.contributor.author | Liao, Y.-C. | en_US |
dc.contributor.author | YING-CHIH LIAO | en_US |
dc.creator | YING-CHIH LIAO;Liao, Y.-C.;Su, C.-H.;Chen, S.-P.;Huang, Y.-K. | - |
dc.date.accessioned | 2018-09-10T15:20:03Z | - |
dc.date.available | 2018-09-10T15:20:03Z | - |
dc.date.issued | 2015 | - |
dc.identifier.uri | http://www.scopus.com/inward/record.url?eid=2-s2.0-84937643951&partnerID=MN8TOARS | - |
dc.identifier.uri | http://scholars.lib.ntu.edu.tw/handle/123456789/391354 | - |
dc.language | en | en |
dc.relation.ispartof | Science of Advanced Materials | en_US |
dc.source | AH | - |
dc.title | Fabrication of copper thin film patterns with highly adhesive silver-decorated polydopamine ink | - |
dc.type | journal article | en |
dc.identifier.doi | 10.1166/sam.2015.2101 | - |
dc.relation.pages | 227-232 | - |
dc.relation.journalvolume | 7 | - |
dc.relation.journalissue | 2 | - |
item.openairetype | journal article | - |
item.fulltext | no fulltext | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.grantfulltext | none | - |
item.cerifentitytype | Publications | - |
crisitem.author.dept | Chemical Engineering | - |
crisitem.author.orcid | 0000-0001-9496-4190 | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 化學工程學系 |
在 IR 系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。