https://scholars.lib.ntu.edu.tw/handle/123456789/396631
Title: | Compact modeling and simulation of TSV with experimental verification | Authors: | Yan, J.-Y. Jan, S.-R. Huang, Y.-C. Lan, H.-S. Liu, C.W. Huang, Y.-H. Hung, B. Chan, K.-T. Huang, M. Yang, M.-T. CHEE-WEE LIU |
Issue Date: | 2016 | Source: | 2016 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2016 | URI: | http://www.scopus.com/inward/record.url?eid=2-s2.0-84978736627&partnerID=MN8TOARS http://scholars.lib.ntu.edu.tw/handle/123456789/396631 |
DOI: | 10.1109/VLSI-TSA.2016.7480488 |
Appears in Collections: | 電機工程學系 |
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