https://scholars.lib.ntu.edu.tw/handle/123456789/415013
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Huang X. | en_US |
dc.contributor.author | Wu W.-F. | en_US |
dc.contributor.author | Chou P.-L. | en_US |
dc.creator | Chou P.-L.;Wu W.-F.;Huang X. | - |
dc.date.accessioned | 2019-07-24T06:36:54Z | - |
dc.date.available | 2019-07-24T06:36:54Z | - |
dc.date.issued | 2012 | - |
dc.identifier.isbn | 9781467349444 | - |
dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84880312400&doi=10.1109%2fEMAP.2012.6507914&partnerID=40&md5=e4269152e84dca02b321336ff46967b3 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/415013 | - |
dc.relation.ispartof | 14th International Conference on Electronic Materials and Packaging | - |
dc.title | Fatigue life and reliability prediction of electronic packages under thermal cycling conditions through FEM analysis and acceleration models | en_US |
dc.type | conference paper | en |
dc.identifier.doi | 10.1109/EMAP.2012.6507914 | - |
dc.identifier.scopus | 2-s2.0-84880312400 | - |
item.openairecristype | http://purl.org/coar/resource_type/c_5794 | - |
item.openairetype | conference paper | - |
item.grantfulltext | none | - |
item.cerifentitytype | Publications | - |
item.fulltext | no fulltext | - |
crisitem.author.dept | Mechanical Engineering | - |
crisitem.author.dept | Industrial Engineering | - |
crisitem.author.orcid | 0000-0001-9637-9534 | - |
crisitem.author.parentorg | College of Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 機械工程學系 |
在 IR 系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。