https://scholars.lib.ntu.edu.tw/handle/123456789/415552
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Hsu, Y. | en |
dc.contributor.author | Wu, W.F. | en |
dc.contributor.author | Hsu, C.M. | en |
dc.contributor.author | 2013 | en |
dc.creator | 2013;Hsu, C.M.;Wu, W.F.;Hsu, Y. | - |
dc.date.accessioned | 2019-07-30T01:41:05Z | - |
dc.date.available | 2019-07-30T01:41:05Z | - |
dc.date.issued | 2013 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/415552 | - |
dc.relation.ispartof | Institute of Industrial Engineers Asian Conference | - |
dc.title | Fatigue Life and Reliability Analysis of Electronic Packages under Thermal Cycling and Moisture Conditions | en |
dc.type | conference paper | en |
item.cerifentitytype | Publications | - |
item.openairetype | conference paper | - |
item.fulltext | no fulltext | - |
item.grantfulltext | none | - |
item.openairecristype | http://purl.org/coar/resource_type/c_5794 | - |
crisitem.author.dept | Mechanical Engineering | - |
crisitem.author.dept | Industrial Engineering | - |
crisitem.author.orcid | 0000-0001-9637-9534 | - |
crisitem.author.parentorg | College of Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 機械工程學系 |
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