|Title:||Effects of silver addition on Cu-Sn microjoints for chip-stacking applications||Authors:||Yang T.L.
|Keywords:||Chip-stacking;Interfacial reactions;Microjoints;Soldering||Issue Date:||2014||Journal Volume:||605||Start page/Pages:||193-198||Source:||Journal of Alloys and Compounds||Abstract:||
The solid-state reactions under confined space between Cu substrate and Sn and Sn-Ag solders are systematically investigated, with the objective of providing fundamental data that are critical to the design of robust microjoints for chip-stacking applications. Sandwich structures of Cu/Sn/Cu and Cu/Sn3.5Ag/Cu are prepared by thermal compression bonding. The thickness of Sn and Sn3.5Ag layer is controlled at 10 £gm. High temperature storage tests are conducted at 120 ¢XC, 150 ¢XC, 180 ¢XC, and 200 ¢XC for different time periods. Unlike the well-known void formation in the Ni/Sn/Ni system, there is no such void at all in the Cu/Sn/Cu system. The addition of Ag consistently slows down the growth kinetics of intermetallics. The time-to-impingement of intermetallics is established for the first time for both systems under solid-state reactions. ? 2014 Elsevier B.V. All rights reserved.
|Appears in Collections:||材料科學與工程學系|
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