https://scholars.lib.ntu.edu.tw/handle/123456789/425018
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Peng J.-S. | en_US |
dc.contributor.author | Fang W. | en_US |
dc.contributor.author | Lin H.-Y. | en_US |
dc.contributor.author | Hsueh C.-H. | en_US |
dc.contributor.author | Lee S. | en_US |
dc.contributor.author | CHUN-HWAY HSUEH | en_US |
dc.creator | Lee S.;Hsueh C.-H.;Lin H.-Y.;Fang W.;Peng J.-S.;CHUN-HWAY HSUEH | - |
dc.date.accessioned | 2019-09-25T04:10:02Z | - |
dc.date.available | 2019-09-25T04:10:02Z | - |
dc.date.issued | 2013 | - |
dc.identifier.issn | 09601317 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/425018 | - |
dc.description.abstract | A series of Parylene C film/silicon substrate bilayer microcantilever beams were fabricated by microelectromechanical processes for the study of residual stresses. The Parylene C films of 2 £gm thickness were deposited on the Si substrates with various thicknesses. After deposition at room temperature, deflection of the beam was observed with deposited Parylene C on the concave side. While Parylene C has a higher coefficient of thermal expansion than Si, this deflection is believed to result from the thermal mismatch between Parylene C and Si, and the temperature of monomer gas (which is formed at 690 ¢XC) flowing across the sample could be higher than 25 ¢XC. It is estimated to be 73 ¢XC based on the fitting of the curvature versus substrate thickness relation between the measurements and analytical solutions. In this case, Parylene C films are subjected to tension. In addition, the residual stress in the Parlyene C film decreases with decreasing substrate thickness. ? 2013 IOP Publishing Ltd. | - |
dc.language | English | - |
dc.relation.ispartof | Journal of Micromechanics and Microengineering | - |
dc.title | Measurements of residual stresses in the Parylene C film/silicon substrate using a microcantilever beam | en_US |
dc.type | journal article | en |
dc.identifier.doi | 10.1088/0960-1317/23/9/095001 | - |
dc.identifier.scopus | 2-s2.0-84884896451 | - |
dc.identifier.url | https://www2.scopus.com/inward/record.uri?eid=2-s2.0-84884896451&doi=10.1088%2f0960-1317%2f23%2f9%2f095001&partnerID=40&md5=02095ec7ba732b087d70a0c500fb5480 | - |
dc.relation.journalvolume | 23 | - |
dc.relation.journalissue | 9 | - |
item.cerifentitytype | Publications | - |
item.fulltext | no fulltext | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.openairetype | journal article | - |
item.grantfulltext | none | - |
crisitem.author.dept | Materials Science and Engineering | - |
crisitem.author.orcid | 0000-0002-6477-7148 | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 材料科學與工程學系 |
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