https://scholars.lib.ntu.edu.tw/handle/123456789/425262
標題: | Simulation studies on bipolar electrostatic chucks | 作者: | Li C.-H. Chiu Y.-F. Yu Y.-H. Chen J.-Z. JIAN-ZHANG CHEN |
公開日期: | 2015 | 起(迄)頁: | 382-385 | 來源出版物: | 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference | 摘要: | We use Comsol Multiphysics, a finite element simulation tool to study a bipolar electrostatic chuck (E-chuck). The influences of the substrate and dielectric types, wafer thickness, and air gap are investigated. ? 2015 IEEE. |
URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/425262 | ISBN: | 9781467383561 | DOI: | 10.1109/IMPACT.2015.7365233 |
顯示於: | 應用力學研究所 |
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