https://scholars.lib.ntu.edu.tw/handle/123456789/425262
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Li C.-H. | en_US |
dc.contributor.author | Chiu Y.-F. | en_US |
dc.contributor.author | Yu Y.-H. | en_US |
dc.contributor.author | Chen J.-Z. | en_US |
dc.contributor.author | JIAN-ZHANG CHEN | en_US |
dc.creator | Chen J.-Z.;Yu Y.-H.;Chiu Y.-F.;Li C.-H.;JIAN-ZHANG CHEN | - |
dc.date.accessioned | 2019-09-26T07:09:20Z | - |
dc.date.available | 2019-09-26T07:09:20Z | - |
dc.date.issued | 2015 | - |
dc.identifier.isbn | 9781467383561 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/425262 | - |
dc.description.abstract | We use Comsol Multiphysics, a finite element simulation tool to study a bipolar electrostatic chuck (E-chuck). The influences of the substrate and dielectric types, wafer thickness, and air gap are investigated. ? 2015 IEEE. | - |
dc.language | English | - |
dc.relation.ispartof | 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference | - |
dc.title | Simulation studies on bipolar electrostatic chucks | en_US |
dc.type | conference paper | en |
dc.identifier.doi | 10.1109/IMPACT.2015.7365233 | - |
dc.identifier.scopus | 2-s2.0-84964290549 | - |
dc.identifier.url | https://www2.scopus.com/inward/record.uri?eid=2-s2.0-84964290549&doi=10.1109%2fIMPACT.2015.7365233&partnerID=40&md5=d2f9b508a1155257bb9336cf153f5c5d | - |
dc.relation.pages | 382-385 | - |
item.openairecristype | http://purl.org/coar/resource_type/c_5794 | - |
item.openairetype | conference paper | - |
item.grantfulltext | none | - |
item.cerifentitytype | Publications | - |
item.fulltext | no fulltext | - |
crisitem.author.dept | Applied Mechanics | - |
crisitem.author.orcid | 0000-0002-1071-2234 | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 應用力學研究所 |
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