Abnormal Cu3Sn growth through grain boundary penetration in space-confined Ni-Sn-Cu diffusion couples

Journal

Journal of Alloys and Compounds

Journal Volume

799

Pages

108-112

Date Issued

2019

Author(s)

Wang Y.W.

Zhu Z.X.

Shih W.L.

DOI

10.1016/j.jallcom.2019.05.328

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-85066604103&doi=10.1016%2fj.jallcom.2019.05.328&partnerID=40&md5=328c148088abbff9de65ce1522b289ad

https://scholars.lib.ntu.edu.tw/handle/123456789/432559

Publisher

Elsevier Ltd

Type

journal article