https://scholars.lib.ntu.edu.tw/handle/123456789/432560
Title: | Mechanical reliability assessment of Cu6Sn5 intermetallic compound and multilayer structures in Cu/Sn interconnects for 3D IC applications | Authors: | Wu J.-Y. Kao C.R. Yang J.-M. C. ROBERT KAO |
Issue Date: | 2019 | Publisher: | Institute of Electrical and Electronics Engineers Inc. | Journal Volume: | 2019-May | Start page/Pages: | 2258-2265 | Source: | Electronic Components and Technology Conference | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85072278860&doi=10.1109%2fECTC.2019.000-8&partnerID=40&md5=d38e97e8de593fbbc84c0632fe01fdc7 https://scholars.lib.ntu.edu.tw/handle/123456789/432560 |
ISBN: | 9781728114989 | ISSN: | 05695503 | DOI: | 10.1109/ECTC.2019.000-8 |
Appears in Collections: | 材料科學與工程學系 |
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