https://scholars.lib.ntu.edu.tw/handle/123456789/432562
Title: | Low temperature and pressureless microfluidic electroless bonding process for vertical interconnections | Authors: | Hung H.-T. Yang S. Weng I.-A. Chen Y.-H. C. ROBERT KAO |
Issue Date: | 2019 | Publisher: | Institute of Electrical and Electronics Engineers Inc. | Journal Volume: | 2019-May | Start page/Pages: | 1729-1734 | Source: | Electronic Components and Technology Conference | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85072282682&doi=10.1109%2fECTC.2019.00265&partnerID=40&md5=a75307e297c1d071705b4252d9efdb54 https://scholars.lib.ntu.edu.tw/handle/123456789/432562 |
ISBN: | 9781728114989 | ISSN: | 05695503 | DOI: | 10.1109/ECTC.2019.00265 |
Appears in Collections: | 材料科學與工程學系 |
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