https://scholars.lib.ntu.edu.tw/handle/123456789/432562
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Hung H.-T. | en_US |
dc.contributor.author | Yang S. | en_US |
dc.contributor.author | Weng I.-A. | en_US |
dc.contributor.author | Chen Y.-H. | en_US |
dc.contributor.author | C. ROBERT KAO | en_US |
dc.creator | C. ROBERT KAO;Kao C.R.;Chen Y.-H.;Weng I.-A.;Yang S.;Hung H.-T. | - |
dc.date.accessioned | 2019-11-27T02:02:12Z | - |
dc.date.available | 2019-11-27T02:02:12Z | - |
dc.date.issued | 2019 | - |
dc.identifier.isbn | 9781728114989 | - |
dc.identifier.issn | 05695503 | - |
dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85072282682&doi=10.1109%2fECTC.2019.00265&partnerID=40&md5=a75307e297c1d071705b4252d9efdb54 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432562 | - |
dc.publisher | Institute of Electrical and Electronics Engineers Inc. | - |
dc.relation.ispartof | Electronic Components and Technology Conference | - |
dc.title | Low temperature and pressureless microfluidic electroless bonding process for vertical interconnections | en_US |
dc.type | conference paper | en |
dc.identifier.doi | 10.1109/ECTC.2019.00265 | - |
dc.identifier.scopus | 2-s2.0-85072282682 | - |
dc.relation.pages | 1729-1734 | - |
dc.relation.journalvolume | 2019-May | - |
item.openairecristype | http://purl.org/coar/resource_type/c_5794 | - |
item.openairetype | conference paper | - |
item.grantfulltext | none | - |
item.cerifentitytype | Publications | - |
item.fulltext | no fulltext | - |
crisitem.author.dept | Materials Science and Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 材料科學與工程學系 |
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