https://scholars.lib.ntu.edu.tw/handle/123456789/432564
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kao L.Y. | en_US |
dc.contributor.author | Hung H.T. | en_US |
dc.contributor.author | Chen Y.H. | en_US |
dc.contributor.author | C. ROBERT KAO | en_US |
dc.creator | C. ROBERT KAO;Kao C.R.;Chen Y.H.;Hung H.T.;Kao L.Y. | - |
dc.date.accessioned | 2019-11-27T02:02:13Z | - |
dc.date.available | 2019-11-27T02:02:13Z | - |
dc.date.issued | 2019 | - |
dc.identifier.isbn | 9784990218867 | - |
dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85068346387&doi=10.23919%2fICEP.2019.8733511&partnerID=40&md5=1b9e5f584ec0fda41c4f6d7630e3cd9b | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432564 | - |
dc.publisher | Institute of Electrical and Electronics Engineers Inc. | - |
dc.relation.ispartof | 2019 International Conference on Electronics Packaging | - |
dc.title | Bonding of Copper Pillars Using Electroless Cu Plating | en_US |
dc.type | conference paper | en |
dc.identifier.doi | 10.23919/ICEP.2019.8733511 | - |
dc.identifier.scopus | 2-s2.0-85068346387 | - |
dc.relation.pages | 220-222 | - |
item.fulltext | no fulltext | - |
item.grantfulltext | none | - |
item.openairetype | conference paper | - |
item.openairecristype | http://purl.org/coar/resource_type/c_5794 | - |
item.cerifentitytype | Publications | - |
crisitem.author.dept | Materials Science and Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
Appears in Collections: | 材料科學與工程學系 |
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