https://scholars.lib.ntu.edu.tw/handle/123456789/432569| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Weng I.A. | en-US |
| dc.contributor.author | Hung H.T. | en-US |
| dc.contributor.author | Yang S. | en-US |
| dc.contributor.author | Kao C.R. | en-US |
| dc.contributor.author | Chen Y.H. | en-US |
| dc.contributor.author | C. ROBERT KAO | zz |
| dc.creator | C. ROBERT KAO;Chen Y.H.;Kao C.R.;Yang S.;Hung H.T.;Weng I.A. | - |
| dc.date.accessioned | 2019-11-27T02:02:15Z | - |
| dc.date.available | 2019-11-27T02:02:15Z | - |
| dc.date.issued | 2019 | - |
| dc.identifier.issn | 13596462 | - |
| dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85053523247&doi=10.1016%2fj.scriptamat.2018.09.026&partnerID=40&md5=f44bf454c3d36cb827358778364bb655 | - |
| dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432569 | - |
| dc.publisher | Acta Materialia Inc | - |
| dc.relation.ispartof | Scripta Materialia | - |
| dc.title | Self-assembly of reduced Au atoms for vertical interconnections in three dimensional integrated circuits | en_US |
| dc.type | journal article | - |
| dc.identifier.doi | 10.1016/j.scriptamat.2018.09.026 | - |
| dc.identifier.scopus | 2-s2.0-85053523247 | - |
| dc.relation.pages | 119-122 | - |
| dc.relation.journalvolume | 159 | - |
| item.fulltext | no fulltext | - |
| item.cerifentitytype | Publications | - |
| item.openairetype | journal article | - |
| item.grantfulltext | none | - |
| item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
| crisitem.author.dept | Materials Science and Engineering | - |
| crisitem.author.parentorg | College of Engineering | - |
| Appears in Collections: | 材料科學與工程學系 | |
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