Self-assembly of reduced Au atoms for vertical interconnections in three dimensional integrated circuits

Journal

Scripta Materialia

Journal Volume

159

Pages

119-122

Date Issued

2019

Author(s)

Weng I.A.

Hung H.T.

Yang S.

Kao C.R.

Chen Y.H.

DOI

10.1016/j.scriptamat.2018.09.026

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-85053523247&doi=10.1016%2fj.scriptamat.2018.09.026&partnerID=40&md5=f44bf454c3d36cb827358778364bb655

https://scholars.lib.ntu.edu.tw/handle/123456789/432569

Publisher

Acta Materialia Inc

Type

journal article