https://scholars.lib.ntu.edu.tw/handle/123456789/432570
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Yu J.J. | en_US |
dc.contributor.author | Yang S. | en_US |
dc.contributor.author | Chung C.K. | en_US |
dc.contributor.author | C. ROBERT KAO | en_US |
dc.creator | C. ROBERT KAO;Kao C.R.;Chung C.K.;Yang S.;Yu J.J. | - |
dc.date.accessioned | 2019-11-27T02:02:15Z | - |
dc.date.available | 2019-11-27T02:02:15Z | - |
dc.date.issued | 2019 | - |
dc.identifier.isbn | 9783800736065 | - |
dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85073561920&partnerID=40&md5=a3e51d352e97c1a545a63fa5f0c5c74f | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432570 | - |
dc.publisher | VDE Verlag GmbH | - |
dc.relation.ispartof | 13th Electronic Circuits World Convention: Connecting the World | - |
dc.title | Effect of Ag concentration on small solder volume Ni/SnAg/Ni system | en_US |
dc.type | conference paper | en |
dc.identifier.scopus | 2-s2.0-85073561920 | - |
item.openairecristype | http://purl.org/coar/resource_type/c_5794 | - |
item.openairetype | conference paper | - |
item.grantfulltext | none | - |
item.cerifentitytype | Publications | - |
item.fulltext | no fulltext | - |
crisitem.author.dept | Materials Science and Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 材料科學與工程學系 |
在 IR 系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。