https://scholars.lib.ntu.edu.tw/handle/123456789/432573
Title: | Enhancement of nano-silver chip attachment by using transient liquid phase reaction with indium | Authors: | Yang C.A. Yang S. Liu X. Nishikawa H. C. ROBERT KAO |
Issue Date: | 2018 | Publisher: | Elsevier Ltd | Journal Volume: | 762 | Start page/Pages: | 586-597 | Source: | Journal of Alloys and Compounds | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85047432595&doi=10.1016%2fj.jallcom.2018.05.254&partnerID=40&md5=92ebf8d14739608c252e67769a074eff https://scholars.lib.ntu.edu.tw/handle/123456789/432573 |
ISSN: | 09258388 | DOI: | 10.1016/j.jallcom.2018.05.254 |
Appears in Collections: | 材料科學與工程學系 |
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