Microstructure Evolution of Cu/In/Cu Joints after Solid-Liquid Interdiffusion

Journal

Electronic Components and Technology Conference

Journal Volume

2018-May

Pages

890-895

ISBN

9781538649985

Date Issued

2018

Author(s)

Chiu Y.S.

DOI

10.1109/ECTC.2018.00137

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-85051920422&doi=10.1109%2fECTC.2018.00137&partnerID=40&md5=a3e44d9a4bd0829b757008dd5b349d5f

https://scholars.lib.ntu.edu.tw/handle/123456789/432574

Publisher

Institute of Electrical and Electronics Engineers Inc.

Type

conference paper