https://scholars.lib.ntu.edu.tw/handle/123456789/432574| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Chiu Y.S. | en-US |
| dc.contributor.author | Kao C.R. | en-US |
| dc.contributor.author | C. ROBERT KAO | zz |
| dc.creator | C. ROBERT KAO;Kao C.R.;Chiu Y.S. | - |
| dc.date.accessioned | 2019-11-27T02:02:17Z | - |
| dc.date.available | 2019-11-27T02:02:17Z | - |
| dc.date.issued | 2018 | - |
| dc.identifier.isbn | 9781538649985 | - |
| dc.identifier.issn | 05695503 | - |
| dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85051920422&doi=10.1109%2fECTC.2018.00137&partnerID=40&md5=a3e44d9a4bd0829b757008dd5b349d5f | - |
| dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432574 | - |
| dc.publisher | Institute of Electrical and Electronics Engineers Inc. | - |
| dc.relation.ispartof | Electronic Components and Technology Conference | - |
| dc.title | Microstructure Evolution of Cu/In/Cu Joints after Solid-Liquid Interdiffusion | en_US |
| dc.type | conference paper | - |
| dc.identifier.doi | 10.1109/ECTC.2018.00137 | - |
| dc.identifier.scopus | 2-s2.0-85051920422 | - |
| dc.relation.pages | 890-895 | - |
| dc.relation.journalvolume | 2018-May | - |
| item.openairetype | conference paper | - |
| item.openairecristype | http://purl.org/coar/resource_type/c_5794 | - |
| item.fulltext | no fulltext | - |
| item.cerifentitytype | Publications | - |
| item.grantfulltext | none | - |
| crisitem.author.dept | Materials Science and Engineering | - |
| crisitem.author.parentorg | College of Engineering | - |
| Appears in Collections: | 材料科學與工程學系 | |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.
