https://scholars.lib.ntu.edu.tw/handle/123456789/432576
Title: | High reliability sintered silver-indium bonding with anti-oxidation property for high temperature applications | Authors: | Yang C.A. Kao C.R. Nishikawa H. Lee C.C. C. ROBERT KAO |
Issue Date: | 2018 | Publisher: | Institute of Electrical and Electronics Engineers Inc. | Journal Volume: | 2018-May | Start page/Pages: | 1993-1999 | Source: | Electronic Components and Technology Conference | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85050278005&doi=10.1109%2fECTC.2018.00299&partnerID=40&md5=dd63f93eea05aa9c0288145d94a79ce0 https://scholars.lib.ntu.edu.tw/handle/123456789/432576 |
ISBN: | 9781538649985 | ISSN: | 05695503 | DOI: | 10.1109/ECTC.2018.00299 |
Appears in Collections: | 材料科學與工程學系 |
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