https://scholars.lib.ntu.edu.tw/handle/123456789/432576| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Yang C.A. | en-US |
| dc.contributor.author | Kao C.R. | en-US |
| dc.contributor.author | Nishikawa H. | en-US |
| dc.contributor.author | Lee C.C. | en-US |
| dc.contributor.author | C. ROBERT KAO | zz |
| dc.creator | C. ROBERT KAO;Lee C.C.;Nishikawa H.;Kao C.R.;Yang C.A. | - |
| dc.date.accessioned | 2019-11-27T02:02:17Z | - |
| dc.date.available | 2019-11-27T02:02:17Z | - |
| dc.date.issued | 2018 | - |
| dc.identifier.isbn | 9781538649985 | - |
| dc.identifier.issn | 05695503 | - |
| dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85050278005&doi=10.1109%2fECTC.2018.00299&partnerID=40&md5=dd63f93eea05aa9c0288145d94a79ce0 | - |
| dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432576 | - |
| dc.publisher | Institute of Electrical and Electronics Engineers Inc. | - |
| dc.relation.ispartof | Electronic Components and Technology Conference | - |
| dc.title | High reliability sintered silver-indium bonding with anti-oxidation property for high temperature applications | en_US |
| dc.type | conference paper | - |
| dc.identifier.doi | 10.1109/ECTC.2018.00299 | - |
| dc.identifier.scopus | 2-s2.0-85050278005 | - |
| dc.relation.pages | 1993-1999 | - |
| dc.relation.journalvolume | 2018-May | - |
| item.cerifentitytype | Publications | - |
| item.fulltext | no fulltext | - |
| item.grantfulltext | none | - |
| item.openairecristype | http://purl.org/coar/resource_type/c_5794 | - |
| item.openairetype | conference paper | - |
| crisitem.author.dept | Materials Science and Engineering | - |
| crisitem.author.parentorg | College of Engineering | - |
| Appears in Collections: | 材料科學與工程學系 | |
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