https://scholars.lib.ntu.edu.tw/handle/123456789/432581
Title: | Bonding of copper pillars using electroless Au plating | Authors: | Weng I.A. Hung H.T. Yang S. Chen Y.H. Kao C.R. C. ROBERT KAO |
Issue Date: | 2018 | Publisher: | Institute of Electrical and Electronics Engineers Inc. | Start page/Pages: | 87-90 | Source: | 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85048831791&doi=10.23919%2fICEP.2018.8374676&partnerID=40&md5=9c044b05b367c0ec20cee79669af18c8 https://scholars.lib.ntu.edu.tw/handle/123456789/432581 |
ISBN: | 9784990218850 | DOI: | 10.23919/ICEP.2018.8374676 |
Appears in Collections: | 材料科學與工程學系 |
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