https://scholars.lib.ntu.edu.tw/handle/123456789/432582
Title: | Materials merging mechanism of microfluidic electroless interconnection process | Authors: | Yang S. Hung H.T. Wu P.Y. Wang Y.W. Nishikawa H. C. ROBERT KAO |
Issue Date: | 2018 | Publisher: | Electrochemical Society Inc. | Journal Volume: | 165 | Journal Issue: | 7 | Start page/Pages: | D273-D281 | Source: | Journal of the Electrochemical Society | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85053548055&doi=10.1149%2f2.0441807jes&partnerID=40&md5=f2b118dde7f8a7395673d7b990ce5de0 https://scholars.lib.ntu.edu.tw/handle/123456789/432582 |
ISSN: | 00134651 | DOI: | 10.1149/2.0441807jes |
Appears in Collections: | 材料科學與工程學系 |
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