https://scholars.lib.ntu.edu.tw/handle/123456789/432597
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Yang T.L. | en_US |
dc.contributor.author | Aoki T. | en_US |
dc.contributor.author | Matsumoto K. | en_US |
dc.contributor.author | Toriyama K. | en_US |
dc.contributor.author | Horibe A. | en_US |
dc.contributor.author | Mori H. | en_US |
dc.contributor.author | Orii Y. | en_US |
dc.contributor.author | Wu J.Y. | en_US |
dc.contributor.author | C. ROBERT KAO | en_US |
dc.creator | C. ROBERT KAO;Kao C.R.;Wu J.Y.;Orii Y.;Mori H.;Horibe A.;Toriyama K.;Matsumoto K.;Aoki T.;Yang T.L. | - |
dc.date.accessioned | 2019-11-27T02:02:24Z | - |
dc.date.available | 2019-11-27T02:02:24Z | - |
dc.date.issued | 2016 | - |
dc.identifier.issn | 13596454 | - |
dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84966286578&doi=10.1016%2fj.actamat.2016.04.046&partnerID=40&md5=95b061ced933a01d92a071cff6a70710 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432597 | - |
dc.publisher | Elsevier Ltd | - |
dc.relation.ispartof | Acta Materialia | - |
dc.title | Full intermetallic joints for chip stacking by using thermal gradient bonding | en_US |
dc.type | journal article | en |
dc.identifier.doi | 10.1016/j.actamat.2016.04.046 | - |
dc.identifier.scopus | 2-s2.0-84966286578 | - |
dc.relation.pages | 90-97 | - |
dc.relation.journalvolume | 113 | - |
item.cerifentitytype | Publications | - |
item.grantfulltext | none | - |
item.fulltext | no fulltext | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.openairetype | journal article | - |
crisitem.author.dept | Materials Science and Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 材料科學與工程學系 |
在 IR 系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。