https://scholars.lib.ntu.edu.tw/handle/123456789/432598| Title: | Au-Sn bonding material for the assembly of power integrated circuit module | Authors: | Zhu Z.X. Li C.C. Liao L.L. Liu C.K. Kao C.R. C. ROBERT KAO |
Issue Date: | 2016 | Publisher: | Elsevier Ltd | Journal Volume: | 671 | Start page/Pages: | 340-345 | Source: | Journal of Alloys and Compounds | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84959296179&doi=10.1016%2fj.jallcom.2016.02.065&partnerID=40&md5=af868a0df4fb52a676774e522c452aa6 https://scholars.lib.ntu.edu.tw/handle/123456789/432598 |
ISSN: | 09258388 | DOI: | 10.1016/j.jallcom.2016.02.065 |
| Appears in Collections: | 材料科學與工程學系 |
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