https://scholars.lib.ntu.edu.tw/handle/123456789/432598
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Zhu Z.X. | en_US |
dc.contributor.author | Li C.C. | en_US |
dc.contributor.author | Liao L.L. | en_US |
dc.contributor.author | Liu C.K. | en_US |
dc.contributor.author | C. ROBERT KAO | en_US |
dc.creator | C. ROBERT KAO;Kao C.R.;Liu C.K.;Liao L.L.;Li C.C.;Zhu Z.X. | - |
dc.date.accessioned | 2019-11-27T02:02:24Z | - |
dc.date.available | 2019-11-27T02:02:24Z | - |
dc.date.issued | 2016 | - |
dc.identifier.issn | 09258388 | - |
dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84959296179&doi=10.1016%2fj.jallcom.2016.02.065&partnerID=40&md5=af868a0df4fb52a676774e522c452aa6 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432598 | - |
dc.publisher | Elsevier Ltd | - |
dc.relation.ispartof | Journal of Alloys and Compounds | - |
dc.title | Au-Sn bonding material for the assembly of power integrated circuit module | en_US |
dc.type | journal article | en |
dc.identifier.doi | 10.1016/j.jallcom.2016.02.065 | - |
dc.identifier.scopus | 2-s2.0-84959296179 | - |
dc.relation.pages | 340-345 | - |
dc.relation.journalvolume | 671 | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.openairetype | journal article | - |
item.grantfulltext | none | - |
item.cerifentitytype | Publications | - |
item.fulltext | no fulltext | - |
crisitem.author.dept | Materials Science and Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 材料科學與工程學系 |
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