https://scholars.lib.ntu.edu.tw/handle/123456789/432600| Title: | Bonding of copper pillars using electroless Ni plating | Authors: | Yang S. Hung H.T. Chen Y.B. Kao C.R. C. ROBERT KAO |
Issue Date: | 2016 | Publisher: | Institute of Electrical and Electronics Engineers Inc. | Start page/Pages: | 493-496 | Source: | 2016 International Conference on Electronics Packaging | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84978224582&doi=10.1109%2fICEP.2016.7486876&partnerID=40&md5=1ba56af57bd833b6ff6445e9628b6c53 https://scholars.lib.ntu.edu.tw/handle/123456789/432600 |
ISBN: | 9784904090176 | DOI: | 10.1109/ICEP.2016.7486876 |
| Appears in Collections: | 材料科學與工程學系 |
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