https://scholars.lib.ntu.edu.tw/handle/123456789/432615
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Key Chung C. | en_US |
dc.contributor.author | Zhu Z.X. | en_US |
dc.contributor.author | C. ROBERT KAO | en_US |
dc.creator | C. ROBERT KAO;Kao C.R.;Zhu Z.X.;Key Chung C. | - |
dc.date.accessioned | 2019-11-27T02:02:30Z | - |
dc.date.available | 2019-11-27T02:02:30Z | - |
dc.date.issued | 2014 | - |
dc.identifier.issn | 03615235 | - |
dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84925502794&doi=10.1007%2fs11664-014-3528-0&partnerID=40&md5=2bf3bca997c4e14cf4035f58ced0158d | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432615 | - |
dc.publisher | Springer New York LLC | - |
dc.relation.ispartof | Journal of Electronic Materials | - |
dc.title | Thermal Stress of Surface Oxide Layer on Micro Solder Bumps During Reflow | en_US |
dc.type | journal article | en |
dc.identifier.doi | 10.1007/s11664-014-3528-0 | - |
dc.identifier.scopus | 2-s2.0-84925502794 | - |
dc.relation.pages | 744-750 | - |
dc.relation.journalvolume | 44 | - |
dc.relation.journalissue | 2 | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.openairetype | journal article | - |
item.grantfulltext | none | - |
item.cerifentitytype | Publications | - |
item.fulltext | no fulltext | - |
crisitem.author.dept | Materials Science and Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 材料科學與工程學系 |
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